Siemens has launched multiple innovative products and technologies in integrated circuit design analysis tools to meet the constantly increasing design complexity and market demand. The following is a specific introduction to the integrated circuit design analysis tool launched by Siemens:

1. Tessent Hi Res Chain tool

Background and Function: As part of the Siemens Tessent chip lifecycle management solution portfolio, the Tessent Hi Res Chain tool considers the challenges of advanced node sizes of 5 nanometers and below. It provides fast transistor level isolation to address defect issues that may arise from minor process changes during manufacturing, increasing diagnostic resolution by over 1.5 times and reducing the need for extensive fault analysis work.

Technical features: This tool associates design information and fault data from manufacturing testing with Tessent's Automatic Test Pattern Generation (ATPG) pattern, transforming failure testing work into actionable insights. It adopts layout aware and unit aware techniques to identify the most likely fault mechanism, logical location, and physical location of defects.

2. Fully automatic electrostatic discharge (ESD) solution

Background and Function: Siemens has also released a new fully automated solution to help IC design teams quickly identify and solve electrostatic discharge (ESD) issues caused by the increasing complexity of next-generation designs. This solution combines the powerful features of Calibre PERC software with the SPICE accuracy of the AI driven Solido Simulation Suite to quickly identify and simulate ESD paths that may not comply with wafer foundry rules through detailed transistor level breakdown models.

Technical features: This automated environment aware IC design verification method helps to quickly deliver reliable and timely IC chips to the market. It provides functions such as automatic voltage propagation, voltage sensing design rule checking, and integration of physical and electrical information in a logic driven layout framework, which can help design teams complete their work under tight schedules.

3. Calibre 3DThermal software

Background and Function: The Calibre 3DThermal software launched by Siemens focuses on the 3D IC market, providing complete chip and package internal thermal analysis for 3D ICs. It integrates Siemens' advanced design tools to capture and analyze thermal data throughout the entire design process, helping to address design and validation challenges from early exploration of chip design and 3D assembly to project signoff processes.

Technical features: Calibre 3DThermal integrates the functions of Siemens Calibre validation software and Calibre 3DSTACK, as well as Simcenter Flotherm's thermal field analysis engine, providing fast modeling and visualization from early internal exploration of chip and packaging design to the signoff stage. This software has strong flexibility, allowing users to conduct feasibility analysis with fewer inputs and perform more detailed analysis after obtaining more detailed information.

4. Solido Design Solutions Series

Background and Function: Siemens, as one of the leading companies in the EDA field, has introduced digital dual core multi physics field and artificial intelligence technology into its Calibre and Solido EDA tools. The Solido design solution series includes Solido Design Environment software and Solido simulation suite, aimed at helping design teams meet and exceed increasingly stringent requirements for power consumption, performance, yield, and reliability.

Technical features: Solido Design Environment software provides a single, comprehensive cockpit that can handle nominal analysis and variation perception analysis, including SPICE level circuit simulation settings, measurement and regression, as well as waveform and statistical result analysis. It utilizes artificial intelligence technology to help users determine optimization paths, improve circuit power, performance, and area, and perform accurate statistical analysis of production yield. The Solido simulation suite includes three new artificial intelligence accelerator tools, Solido SPICE, Solido FastSPICE, and Solido LibSPICE, to address the challenges of designing mixed signals and customizing chips.

Siemens' continuous innovation and breakthroughs in integrated circuit design and analysis tools have brought multiple benefits, including technological advancements, market and industry promotion, win-win situations for customers and partners, and leading industry innovation. These benefits not only promote Siemens' own development and growth, but also have a profound impact on the entire semiconductor industry and market.